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TI公司的AM5749是高性別能Sitara ARM應用處理器，具有帶Neon擴展的雙核ARM Cortex-A15 RISC CPU和兩個TIC66x VLIW浮點DSP核，集成了多達2.5MB L3 RAM，兩個DDR3/DDR3L存儲器接口（EMIF）模塊，支持速率到DDR3-1333，多達2GB/EMIF，支持ECC/EMIF，主要用在工業通信，人機接口（HMI），自動化和控制，高性能應用以及其它通用應用。本文介紹了AM5749主要特性，框圖，DDR3接口電路以及評估模塊AM574x IDK框圖，電路圖，材料清單和PCB設計圖。
AM574x Sitara Arm applications processors are built to meet the intense processing needs of modernembedded products.
AM574x devices bring high processing performance through the maximum flexibility of a fully integratedmixed processor solution. The devices also combine programmable video processing with a highlyintegrated peripheral set. Cryptographic acceleration is available in every AM574x device.
Programmability is provided by dual-core Arm Cortex-A15 RISC CPUs with Neon? extension， and two TIC66x VLIW floating-point DSP cores. The Arm allows developers to keep control functions separate fromother algorithms programmed on the DSPs and coprocessors， thus reducing the complexity of the systemsoftware.
Additionally， TI provides a complete set of development tools for the Arm and C66x DSP， including Ccompilers， a DSP assembly optimizer to simplify programming and scheduling， and a debugging interfacefor visibility into source code execution.
Cryptographic acceleration is available in all devices. All other supported security features， includingsupport for secure boot， debug security and support for trusted execution environment are available onHigh-Security （HS） devices. For more information about HS devices， contact your TI representative.
AM5749主要特性：
? Dual Arm? Cortex?-A15 MicroprocessorSubsystem
? Up to two C66x Floating-Point VLIW DSP
– Fully Object-Code Compatible With C67x andC64x+
– Up to Thirty-two 16 × 16-Bit Fixed-PointMultiplies per Cycle
? Up to 2.5MB of On-Chip L3 RAM
? Two DDR3/DDR3L Memory Interface （EMIF）Modules
– Supports rates up to DDR3-1333
– Up to 2GB Supported per EMIF
– ECC supported on primary EMIF
? 2× Dual Arm? Cortex?-M4 co-processors （IPU1and IPU2）
? Up to Two Embedded Vision Engines （EVEs）
? IVA-HD Subsystem
– 4K @ 15fps encode and decode support forH.264 CODEC
– Other CODECs are up to 1080p60
? Display Subsystem
– Full-HD Video （1920×1080p， 60 fps）
– Multiple Video Input and Video Output
– 2D and 3D Graphics
– Display Controller With DMA Engine and up toThree Pipelines
– HDMI? Encoder： HDMI 1.4a and DVI 1.0Compliant
? 2× Dual-Core Programmable Real-Time Unit andIndustrial Communication Subsystem （PRU-ICSS）
? 2D-Graphics Accelerator （BB2D） Subsystem
– Vivante? GC320 Core
? Video Processing Engine （VPE）
? Dual-Core PowerVR? SGX544 3D GPU
? Secure Boot support
– Hardware-enforced Root-of-trust
– Customer programmable keys and OTP data
– Support for Takeover protection， IP protection，and anti-roll back protection
? Cryptographic Acceleration support
– Supports cryptographic cores
– AES – 128/192/256-bits key sizes
– 3DES – 56/112/168-bits key sizes
– MD5， SHA1
– SHA2 – 224/256/384/512
– True Random number generator
– DMA support
? Debug security
– Secure software controlled debug access
– Security aware debugging
? Trusted Execution Environment （TEE） support
– Arm TrustZone based TEE
– Extensive Firewall support for isolation
– Secure DMA path and interconnect
– Secure watchdog/timer/IPC
? Two Video Input Port （VIP） Modules
– Support for up to eight Multiplexed Input Ports
? General-Purpose Memory Controller （GPMC）
? Enhanced Direct Memory Access （EDMA）Controller
? 2-Port Gigabit Ethernet （GMAC）
? Sixteen 32-Bit General-Purpose Timers
? 32-Bit MPU Watchdog Timer
? Five Inter-Integrated Circuit （I2C） Ports
? HDQ?/ 1-Wire ? Interface
? Ten Configurable UART/IrDA/CIR Modules
? Four Multichannel Serial Peripheral Interfaces（McSPI）
? Quad SPI Interface （QSPI）
? SATA Gen2 Interface
? Eight Multichannel Audio Serial Port （McASP）Modules
? SuperSpeed USB 3.0 Dual-Role Device
? High-Speed USB 2.0 Dual-Role Device
? Four MultiMedia Card/Secure Digital/Secure DigitalInput Output Interfaces （ MMC?/ SD?/SDIO）
? PCI Express? 3.0 Subsystems With Two 5-GbpsLanes
– One 2-lane Gen2-Compliant Port
– or Two 1-lane Gen2-Compliant Ports
? Up to two Controller Area Network （DCAN）Modules
– CAN 2.0B Protocol
? Modular Controller Area Network （MCAN） Module
– CAN 2.0B Protocol with available FD（Flexible Data Rate） functionality
? Up to 247 General-Purpose I/O （GPIO） Pins
? Power， Reset， and Clock Management
? On-Chip Debug With CTools Technology
? 28-nm CMOS Technology
? 23 mm × 23 mm， 0.8-mm Pitch， 760-Pin BGA（ABZ）
AM5749應用：
? Industrial Communication
? Human Machine Interface （HMI）
? Automation and Control
? High Performance Applications
? Other General Use
圖1.AM5749框圖
圖2.采用兩個16位DDR3器件32位一組DDR3接口電路圖
圖3.采用四個8位DDR3器件32位一組DDR3接口電路圖
評估模塊AM574x IDK
AM574x Industrial Development Kit （IDK） Evaluation Module （EVM）
The AM574x IDK is a standalone test， development， and evaluation module that enables developers towrite software and develop hardware for industrial control and industrial communications applications. Ithas been equipped with a TI AM5748 processor and a defined set of features to allow you to experienceindustrial communication solutions using various serial or Ethernet based interfaces. Using standardinterfaces， the AM574x IDK may interface to other processors or systems and act as a communicationgateway or controller. In addition， it can directly operate as a standard remote I/O system or a sensor connected to an industrial communication network.
The AM574x IDK contains embedded emulation circuitry to quickly enable developers to begin using thisIDK. The embedded emulation logic allows emulation and debug using standard development tools suchas the Texas Instruments Code Composer Studio? integrated development environment （IDE） by simplyconnecting a USB cable to a Windows?-based computer.
The standard configuration for the AM574x IDK EVM provides the following Ethernet connectivity：
? Two Gigabit （1000Mb） metallic ports connected via PHY/RGMII to the on-chip Ethernet switch
? Two 100Mb metallic ports connected via PHY/MII to the PRU-ICSS subsystems
Reconfiguration through resistor removal and installation can provide an alternate Ethernet connectivity：
? Four 100Mb metallic ports connected via PHY/MII to the PRU-ICSS subsystems
Software support for the AM574x IDK EVM is provided within the Processor Software Development Kit（SDK） package. This includes both Linux and RTOS support.
圖4.評估模塊AM574x IDK外形圖
圖5.評估模塊AM574x IDK外形圖（背面）
圖6.評估模塊AM574x IDK框圖
圖7.評估模塊AM574x IDK電路圖（1）
圖8.評估模塊AM574x IDK電路圖（2）
圖9.評估模塊AM574x IDK電路圖（3）
圖10.評估模塊AM574x IDK電路圖（4）
圖11.評估模塊AM574x IDK電路圖（5）
圖12.評估模塊AM574x IDK電路圖（6）
圖13.評估模塊AM574x IDK電路圖（7）
圖14.評估模塊AM574x IDK電路圖（8）
圖15.評估模塊AM574x IDK電路圖（9）
圖16.評估模塊AM574x IDK電路圖（10）
圖17.評估模塊AM574x IDK電路圖（11）
圖18.評估模塊AM574x IDK電路圖（12）
圖19.評估模塊AM574x IDK電路圖（13）
圖20.評估模塊AM574x IDK電路圖（14）
圖21.評估模塊AM574x IDK電路圖（15）
圖22.評估模塊AM574x IDK電路圖（16）
圖23.評估模塊AM574x IDK電路圖（17）
圖24.評估模塊AM574x IDK電路圖（18）
圖25.評估模塊AM574x IDK電路圖（19）
圖26.評估模塊AM574x IDK電路圖（20）
圖27.評估模塊AM574x IDK電路圖（21）
圖28.評估模塊AM574x IDK電路圖（22）
圖29.評估模塊AM574x IDK電路圖（23）
圖30.評估模塊AM574x IDK電路圖（24）
圖31.評估模塊AM574x IDK電路圖（25）
圖32.評估模塊AM574x IDK電路圖（26）
圖33.評估模塊AM574x IDK電路圖（27）
圖34.評估模塊AM574x IDK電路圖（28）
圖35.評估模塊AM574x IDK電路圖（29）
圖36.評估模塊AM574x IDK電路圖（30）
圖37.評估模塊AM574x IDK電路圖（31）
圖38.評估模塊AM574x IDK電路圖（32）
評估模塊AM574x IDK材料清單：
圖39.評估模塊AM574x IDK PCB設計圖（1）
圖40.評估模塊AM574x IDK PCB設計圖（2）
圖41.評估模塊AM574x IDK PCB設計圖（3）
圖42.評估模塊AM574x IDK PCB設計圖（4）
圖43.評估模塊AM574x IDK PCB設計圖（5）
圖44.評估模塊AM574x IDK PCB設計圖（6）
圖45.評估模塊AM574x IDK PCB設計圖（7）
圖46.評估模塊AM574x IDK PCB設計圖（8）
圖47.評估模塊AM574x IDK PCB設計圖（9）
圖48.評估模塊AM574x IDK PCB設計圖（10）
圖49.評估模塊AM574x IDK PCB設計圖（11）
圖50.評估模塊AM574x IDK PCB設計圖（12）
圖51.評估模塊AM574x IDK PCB設計圖（13）
圖52.評估模塊AM574x IDK PCB設計圖（14）
圖53.評估模塊AM574x IDK PCB設計圖（15）
圖54.評估模塊AM574x IDK PCB設計圖（16）
圖55.評估模塊AM574x IDK PCB設計圖（17）
圖56.評估模塊AM574x IDK PCB設計圖（18）
圖57.評估模塊AM574x IDK PCB設計圖（19）
圖58.評估模塊AM574x IDK PCB設計圖（20）
圖59.評估模塊AM574x IDK PCB設計圖（21）
詳情請見：
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am5749.pdf
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