200μm HPCF Fiber for Data-communication

Molex 200μmHPCF fiber for data-communications,crimp and cleave compatible

說明：Molex 200μmHPCF fiber for data-communications,crimp and cleave compatible

Characteristics

○ Step index
○ Low-OH,synthetic fused silica core,PolyClad hard polymer clad,ETFE buffer or jacket
○ Broad operating wavelength range, optimized at 650 and 850nm
○ Minimal connector offsets due to high clad/core diameter ratio
○ High tensile strength and minimal bend radius for high reliability
○ Crimp/cleave and epoxy/polish compatible
○ Large core and high na provides easy termination and high coupling efficiency to light source
○ Chemically resistant
○ Flame retardant
○ Short-to-medium distance data communications for factory automation and process control
 

○ ROHS compliant

Specifications

Applications

Chemical plants  

Refineries  

Avionics  

Automotive Production/manufacturing plants    

Mobile platforms  

Wind power  

Power plants 

PLC’S