| Number of channels (#) | 1 |
| Total supply voltage (Max) (+5V=5, +/-5V=10) | 10 |
| Total supply voltage (Min) (+5V=5, +/-5V=10) | 2.7 |
| Rail-to-rail | In to V-, Out |
| GBW (Typ) (MHz) | 0.065 |
| Slew rate (Typ) (V/us) | 0.025 |
| Vos (offset voltage @ 25 C) (Max) (mV) | 3 |
| Iq per channel (Typ) (mA) | 0.013 |
| Vn at 1 kHz (Typ) (nV/rtHz) | 21 |
| Rating | Catalog |
| Operating temperature range (C) | -40 to 85, 0 to 70 |
| Offset drift (Typ) (uV/C) | 0.5 |
| Features | High Cload Drive |
| Input bias current (Max) (pA) | 60 |
| CMRR (Typ) (dB) | 83 |
| Output current (Typ) (mA) | 10 |
| Architecture | CMOS |
- Output Swing Includes Both Supply Rails
- Low Noise...21 nV/
Hz Typ at f = 1 kHz - Low Input Bias Current...1 pA Typ
- Very Low Power...11 μA Per Channel Typ
- Common-Mode Input Voltage Range Includes Negative Rail
- Wide Supply Voltage Range 2.7 V to 10 V
- Available in the SOT-23 Package
- Macromodel Included
Advanced LinCMOS is a trademark of Texas Instruments.
The TLV2211 is a single low-voltage operational amplifier available in the SOT-23 package. It consumes only 11 μA (typ) of supply current and is ideal for battery-power applications. The TLV2211 has a 3-V noise level of 22 nV/ Hz at 1kHz; 5 times lower than competitive SOT-23 micropower solutions. The device exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The TLV2211 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.
The TLV2211, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single or split supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs).
With a total area of 5.6mm2, the SOT-23 package only requires one-third the board space of the standard 8-pin SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal source, minimizing noise pick-up from long PCB traces. TI has also taken special care to provide a pinout that is optimized for board layout. Both inputs are separated by GND to prevent coupling or leakage paths. The OUT and IN- terminals are on the same end of the board to provide negative feedback. Finally, gain setting resistors and decoupling capacitor are easily placed around the package.
