| Audio input type | Analog Input |
| Architecture | Class-AB |
| Speaker channels (Max) | Mono |
| Power stage supply (Max) (V) | 5.5 |
| Power stage supply (Min) (V) | 2.5 |
| Load (Min) (ohms) | 8 |
| Output power (W) | 0.7 |
| THD + N @ 1 kHz (%) | 0.5 |
| Iq (Typ) (mA) | 1.25 |
| Control interface | Hardware |
| Closed/open loop | Closed |
| Analog supply (Min) (V) | 2.5 |
| Analog supply (Max) (V) | 5.5 |
| PSRR (dB) | 85 |
| Operating temperature range (C) | -40 to 85 |
- Fully Specified for 3.3-V and 5-V Operation
- Wide Power Supply Compatibility 2.5 V – 5.5 V
- Output Power for RL = 8
- 700 mW at VDD = 5 V, BTL
- 250 mW at VDD = 3.3 V, BTL
- Ultralow Quiescent Current in Shutdown Mode . . . 1.5 nA
- Thermal and Short-Circuit Protection
- Surface-Mount Packaging
- SOIC
- PowerPAD? MSOP
PowerPAD is a trademark of Texas Instruments.
The TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
