| Technology Family | LVC |
| Supply voltage (Min) (V) | 1.65 |
| Supply voltage (Max) (V) | 5.5 |
| Number of channels (#) | 2 |
| IOL (Max) (mA) | 32 |
| IOH (Max) (mA) | -32 |
| ICC (Max) (uA) | 10 |
| Input type | Standard CMOS |
| Output type | Push-Pull |
| Features | Balanced outputs, Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs |
| Rating | HiRel Enhanced Product |
- Controlled Baseline
- One Assembly Site
- One Test Site
- One Fabrication Site
- Extended Temperature Performance of -55°C to 125°C
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product-Change Notification
- Qualification Pedigree(1)
- Available in the Texas Instruments NanoStar? and NanoFree? Packages
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Max tpd of 4.1 ns at 3.3 V
- Low Power Consumption, 10-μA Max ICC
- ±24-mA Output Drive at 3.3 V
- Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C
- Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C
- Ioff Supports Partial Power-Down-Mode Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
NanoStar, NanoFree are trademarks of Texas Instruments.
This dual inverter is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC2G04 performs the Boolean function Y = A.
NanoStar? and NanoFree? package technology is a major breakthrough in IC packaging concepts, using the die as the package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
