| Technology Family | F |
| Supply voltage (Min) (V) | 4.5 |
| Supply voltage (Max) (V) | 5.5 |
| Number of channels (#) | 8 |
| IOL (Max) (mA) | 64 |
| ICC (Max) (uA) | 90000 |
| IOH (Max) (mA) | -15 |
| Input type | Bipolar |
| Output type | 3-State |
| Features | Very high speed (tpd 5-10ns), Over-voltage tolerant inputs |
| Rating | Military |
- 3-State Outputs Drive Bus Lines or Buffer Memory Address Registers
- Package Options Include Plastic Small-Outline (SOIC) and Shrink Small-Outline (SSOP) Packages, Ceramic Chip Carriers, and Plastic and Ceramic DIPs
These octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters. Taken together with the ′F240 and ′F241, these devices provide the choice of selected combinations of inverting and noninverting outputs, symmetrical 
(active-low output-enable) inputs, and complementary OE and inputs.
The ′F244 is organized as two 4-bit buffers/line drivers with separate output enable () inputs. When is low, the device passes data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.
The SN74F244 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area.
The SN54F244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74F244 is characterized for operation from 0°C to 70°C.
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