面向電子裝聯(lián)的PCB 可制造性設(shè)計(jì)
烽火通信科技股份有限公司鮮飛
摘 要: 當(dāng)前電子產(chǎn)品日新月異，要求電路板高密度組裝，安裝方式由表面安裝（SMT）
取代通孔插裝（THT）已是歷史的必然，因此，印制板技術(shù)正向高密度、多層化方向飛速發(fā)展。而印制板的合理設(shè)計(jì)是SMT 技術(shù)中的關(guān)鍵，也是SMT 工藝質(zhì)量的保證，并有助于提高生產(chǎn)效率。本文就表面安裝PCB 設(shè)計(jì)時(shí)需考慮的一些制造工藝性問題進(jìn)行了闡述，給PCB 設(shè)計(jì)人員提供一個(gè)參考。
關(guān)鍵詞: 印制板；可制造性設(shè)計(jì)；電子裝聯(lián)
DFM of PCB Facing to Electronics Assembly
Xian Fei
(Fiberhome Telecommunication Technologies Co.,Ltd, Wuhan 430074,China)
Abstract: Nowadays, high-density and multi-layer PCB Technology are developing faster and
faster in order to meet the need of rapid progress of electronic products. So it has become a must o substitute SMT for THT. PCB design is the key of Surface Mount Technology and guarantee f SMT quality, and it can increase efficiency of production.. The paper illustrates some of the oncerns in SMT processing technology on PCB designs，offers a reference for PCB designer.
Keywords: PCB; DFM; Electronics Assembly