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型號 | 描述 | 數(shù)據(jù)手冊 | 參考價格 |
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ETCSP | ETCSP - the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. - Amkor Technology |
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MCMPBGA | MCMPBGA - Innovative designs and expanding package offerings provide a platform from prototype-to-production - Amkor Technology |
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PLCC | PLCC - Amkora€?s PLCC IC package portfolio provides - Amkor Technology |
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PBGA | PBGA - Innovative designs and expanding package offerings provide a platform from prototype-to-production - Amkor Technology |
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PPGA | PPGA - Plastic Pin Grid Array Package - Amkor Technology |
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POWERSOP2 | POWERSOP2 - Exceptional performance through the innovative design of PSOPs offer - Amkor Technology |
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LCC | LCC - Leadless Chip Carrier Package - Amkor Technology |
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CVBGA | CVBGA - ChipArray? Packages - Amkor Technology |
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CSSOP | CSSOP - Ceramic Shrink Small Outline Package - Amkor Technology |
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CSPNL | CSPNL - Wafer Level Packaging - Amkor Technology |
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CSOIC | CSOIC - Ceramic Small Outline Integrated Circuit Package - Amkor Technology |
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LQFP | LQFP - Low Profile Quad Flat Pack (LQFP) Packages - Amkor Technology |
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CPGA | CPGA - Ceramic Pin Grid Array Package - Amkor Technology |
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CMCM | CMCM - Ceramic Multi-Chip Module Package - Amkor Technology |
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CLGA | CLGA - Ceramic Land Grid Array Package - Amkor Technology |
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CERDIP | CERDIP - Ceramic Dual-Inline Package - Amkor Technology |
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MQFP | MQFP - Amkor’s MQFP IC package portfolio provides - Amkor Technology |
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FCCSP | FCCSP - a flip chip solution in a CSP package format. - Amkor Technology |
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